|High-entropy alloys has become an exciting and vibrant field of materials science and engineering since the concept was proposed by Prof. Jien-Wei Yeh. Symposia, meetings and workshops on topics of high-entropy alloys are being held, and a rapid increase in numbers of journal publications and citations is evident. This design concept allows compositions beyond the scope of traditional materials, which offers unprecedented properties and opportunities for a wide range of structural and functional applications. The 1st International Conference on High-Entropy Materials (ICHEM 2016) is thus being held at the National Tsing Hua University, Taiwan, from Nov. 6‒9, 2016. It gathers research groups around the world to present the latest development in High-Entropy Materials (HEMs). It also offers a platform for networking, collaboration and information exchange in the community. To deliver the excellent research works presented in the ICHEM 2016 to global audiences and to accelerate the development of high-entropy materials, the SCI journal Materials Chemistry and Physics (MCP, Elsevier) plans to publish a special issue on “High-Entropy Materials” in 2017. This special issue welcomes submissions from the field of high-entropy materials.
Follow the Guide to Authors of Elsevier Materials Chemistry and Physics and submit manuscripts at http://www.journals.elsevier.com/materials-chemistry-and-physics. Articles with poor English, ethic problem or out of scope may be directly rejected.
|Topics of Interest (high-entropy materials)
Material and process development
High-temp. and radiation-resistant materials
Coatings and thin films
Physical metallurgy and solid State physics
Physical, chemical and functional properties
Structure and characterization
Simulations and modeling
|Managing Guest Editor
Jien-Wei Yeh, National Tsing Hua University
Rajarshi Banerjee, University of North Texas
Pinaki Prasad Bhattacharjee, IIT Hyderabad
Shou-Yi Chang, National Tsing Hua University
Jean-Philippe Couzinie, ICMPE (UMR 7182)
Sheng Guo, Chalmers University of Technol.
Pedro Rivera, University of Cambridge
Ming-Hung Tsai, National Chung Hsing Univ.
Ke-Fu Yao, Tsinghua University
|Submissions open Nov. 15, 2016
|Submissions close Mar. 31, 2017
|Final decisions made Jun. 30. 2017
|Issue published Aug. 01 – Sept. 01, 2017